Atomic white-out: enabling atomic circuitry through mechanically induced bonding of single hydrogen atoms to a silicon surface
Atomic white-out: enabling atomic circuitry through mechanically induced bonding of single hydrogen atoms to a silicon surface
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DOI | Resolve DOI: https://doi.org/10.1021/acsnano.7b04238 |
Author | Search for: Huff, Taleana R.; Search for: Labidi, Hatem1; Search for: Rashidi, Mohammad1; Search for: Koleini, Mohammad1; Search for: Achal, Roshan; Search for: Salomons, Mark H.1; Search for: Wolkow, Robert A.1 |
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Format | Text, Article |
Journal title | ACS Nano |
ISSN | 1936-0851 1936-086X |
Volume | 11 |
Issue | 9 |
Pages | 8636–8642 |
Subject | AFM; dangling bonds; mechanochemistry; nanofabrication; nanolithography; nanostructures; silicon |
Abstract | |
Publication date | 2017-07-18 |
Publisher | American Chemical Society |
Language | English |
Peer reviewed | Yes |
NPARC number | 23002386 |
Export citation | Export as RIS |
Report a correction | Report a correction | Record identifier | dab42061-686c-4973-9e25-a7ae29497615 |
Record created | 2017-10-26 |
Record modified | 2020-05-30 |