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Dielectrophoretic integration of nanodevices with CMOS VLSI circuitry

From National Research Council Canada

DOIResolve DOI: https://doi.org/10.1109/TNANO.2006.869679
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FormatText, Article
SubjectBiCMOS integrated circuits; BiCMOS process; CMOS integrated circuits; CMOS VLSI circuitry; communications circuitry; Complementary metal; complementary metal-oxide; semiconductor circuitry design; cylindrical structures; dielectrophoresis (DEP); dielectrophoretic forces; dielectrophoretic integration; electrophoresis; elemental semiconductors; Ge-Si alloys; integrated circuit design; mixed-mode integrated circuits; nanodevices; nanosensors; nanostructure; nanotechnology; oxide; porous membranes; post-integrated-circuit assembly; semiconductor (CMOS); semiconductor materials; sensors; signal processing; silicon; Si-SiGe; very large scale integration (VLSI); VLSI
Abstract
We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, thus allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-integrated-circuit assembly of the nanostructures. We report the results of assembly experiments performed on complementary metal-oxide-semiconductor (CMOS) circuitry designed using Freescale semiconductor's HiP6W low-voltage 0.18-/spl mu/m Si/SiGe BiCMOS process.
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  • IEEE Transactinos on Nanotechnology 5, no. 2 (13 March 2006): 101–109.
LanguageEnglish
Peer reviewedYes
NRC publication
This is a non-NRC publication

"Non-NRC publications" are publications authored by NRC employees prior to their employment by NRC.

NRC number11
NPARC number12339033
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Record identifiercdb33c81-0889-402c-ab9c-38f3be2d81bc
Record created2009-09-11
Record modified2020-04-22
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