Fabrication and atomistic modeling of ion-etch nanostructures on substrates

DOI	Resolve DOI: https://doi.org/10.1557/PROC-849-KK6.9
Author	Search for: Stepanova, Maria; Search for: Dew, Steven K.
Editor	Search for: Gilmer, George H.; Search for: Huang, Hanchen; Search for: Wang, Enge
Format	Text, Article
Conference	2004 MRS Fall Meeting: Symposium KK: Kinetics-Driven Nanopatterning on Surfaces, November 29-December 3, 2004, Boston, Massachusetts, USA
Abstract	We have implemented and investigated numerically a new process to fabricate self-organized metal networks and lines on non-metallic substrates. We have deposited a thin film of Cu on silicon and glass substrates and etched the film by a 1 keV-energy Ar beam. Due to the kinetic mechanism known as sputter instability, nanosize metal patterns self-organize on the substrate at the stage when the etched surface reaches the metal/substrate interface. By numerical simulations, we have investigated the mechanism and control factors for the process.
Publication date	2005
In	2004 MRS Fall Meeting - Symposium KK – Kinetics-Driven Nanopatterning on Surfaces, L9.11 (2005): 35–40.
Series	Materials Research Society Symposia Proceedings, no. 849.
Peer reviewed	Yes
NRC publication	This is a non-NRC publication "Non-NRC publications" are publications authored by NRC employees prior to their employment by NRC.
NRC number	19
NPARC number	12328314
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Record identifier	a3ad38b8-c83d-49f8-98cf-8ba945494b44
Record created	2009-09-10
Record modified	2020-04-07