Electromechanical Analysis of a Piezoelectric Instrumented Composite Bonded Repair Patch
Electromechanical Analysis of a Piezoelectric Instrumented Composite Bonded Repair Patch
| Author | Search for: 1; Search for: 2; Search for: 2; Search for: 2; Search for: 3 |
|---|---|
| Affiliation |
|
| Format | Text, Article |
| Conference | The Third Canadian International Composites Conference (CANCOM 2001) From 8/21/2001 To 8/24/2001 |
| Subject | Piezoelectric sensors; bonded repairs; finite element analysis; Adhesive bondline moniotiring |
| Access condition |
|
| Peer reviewed | Yes |
| NRC number | SMPL-2001-0128 |
| NPARC number | 8933769 |
| Export citation | Export as RIS |
| Report a correction | Report a correction (opens in a new tab) |
| Record identifier | 82d0bf8b-4d98-42ee-8be7-fd815eceda34 |
| Record created | 2009-04-23 |
| Record modified | 2020-04-16 |
- Date modified: