A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone
A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone
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| DOI | Resolve DOI: https://doi.org/10.1021/ma00011a012 |
| Author | Search for: 1; Search for: 1; Search for: 1 |
| Affiliation |
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| Format | Text, Article |
| Abstract | |
| Publication date | 1991-05-01 |
| Publisher | American Chemical Society |
| In | |
| Language | English |
| Peer reviewed | Yes |
| NRC number | CNRC 31698 NRC-IGM90AP-32004-1028-G |
| NPARC number | 23003993 |
| Export citation | Export as RIS |
| Report a correction | Report a correction (opens in a new tab) |
| Record identifier | 7b54d765-52b1-4e33-bd84-e08028aec153 |
| Record created | 2018-09-11 |
| Record modified | 2020-05-30 |
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