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Healing study of poly (ether-imide) and poly ether ether ketone using resin films and a parallel plate rheometer

From National Research Council Canada

DOIResolve DOI: https://doi.org/10.1016/j.compositesa.2023.107736
AuthorSearch for: 1ORCID identifier: https://orcid.org/0000-0002-4497-6174; Search for: ORCID identifier: https://orcid.org/0000-0003-2315-2536; Search for: ; Search for: 1
Affiliation
  1. National Research Council Canada. Aerospace
FunderSearch for: Centre de Recherche sur les Systèmes Polymères et Composites à Haute Performance; Search for: McGill University; Search for: National Research Council Canada
FormatText, Article
Subjectthermoplastic resin; interface; rheology; joining
Abstract
A healing study of poly (ether-imide) (PEI) and poly ether ether ketone (PEEK) resin films is conducted using a parallel plate rheometer to obtain the welding times of the materials (i.e., the point at which full degree of healing is attained). Pull-out tests are performed at different healing temperatures, and above the glass transition and melting temperatures of the materials in three different combinations: PEI/PEI, PEI/PEEK, and PEEK/PEEK. Process maps are created, relating temperature, T, and contact time, tc, to the thermoplastic composite repair operation. Full degree of healing is obtained with these material combinations by adjusting the contact time at different processing temperatures. The results from this study could be used to model the behaviour of the PEI and PEEK interfaces during the welding process, which may lead to a controlled and robust repair process.
Publication date
PublisherElsevier
In
  • Composites Part A: Applied Science and Manufacturing 174, no. C, 107736 (November 2023).
LanguageEnglish
Peer reviewedYes
IdentifierS1359835X23003123
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Record identifier5a4d6246-1085-4281-b6fe-ea0d987c6ccf
Record created2024-07-22
Record modified2025-11-03
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