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Composite spreader for cooling computer chip with non-uniform heat dissipation

From National Research Council Canada

DOIResolve DOI: https://doi.org/10.1109/TCAPT.2008.916847
AuthorSearch for: ; Search for: 1
Affiliation
  1. National Research Council of Canada. NRC Institute for Research in Construction
FormatText, Article
Subjectcomposite spreader, copper (CU), dielectric liquid, high-power chip, non-uniform heat flux, nucleate boiling, porous graphite (PG), power dissipation, thermal resistance; Fire
Publication date
In
  • IEEE Transactions on Components and Packaging Technologies 31, no. March 1 (1 March 2008): 165–172.
LanguageEnglish
Peer reviewedYes
NRC numberNRCC 50573
NRC-IRC-19772
NPARC number20326261
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Record identifier46a64994-85f4-4514-8506-d66da83a5828
Record created2012-07-18
Record modified2020-04-15
Date modified: